Application Note 9855
The timing between the clock and the data will effect spectral
performance and functionality. Minimum setup and hold times
are specified in the datasheet to represent the point at which
the DAC begins to lose bits. Optimal setup and hold times
vary with the clock rate to output frequency ratio. A general
rule is that the lower the F CLK /F OUT ratio is, the higher the
setup time should be to achieve optimum spectral behavior.
Getting Started
A summary of the external supplies, equipment, and signal
sources needed to operate the board is given below:
1. +5V to +3V supply for HI5x60 DAC.
2. Pattern Generator.
3. Square wave clock source (usually part of the Pattern
Generator).
4. Spectrum Analyzer or Oscilloscope for viewing the output
of the converter.
HP-SMA TEST BOARD
( INTERSIL MADE)
16 BITS AVAILABLE
Attach the evaluation board to the power supply(s). Connect
the bits from the data generator to the evaluation board,
preferably by using a male, 64 or 96-pin VME (Versa Module
Eurocard) connector that mates with the evaluation board.
Connect the clock source to the evaluation board, also
preferably through the VME connector. Failure to make clean
and short connections to the data input lines and clock
source will result in a decrease in spectral performance.
Using a coaxial cable with the proper SMA connector, attach
the output of the converter, I OUT , to the measurement
equipment that will be evaluating the converter’s
performance. Make sure that the jumpers are in their proper
placement. Consult the ‘Voltage Reference’ section and the
‘Sleep’ section of this document for a de?nition of the
jumpers’ functionality.
HI5828 EVALUATION BOARD
UP TO
14 BITS
1/2 HI5828
DUAL DAC
CLOCK
1/2 HI5828
DUAL DAC
CLK
CLK
UP TO
14 BITS
+5V TO +3V
POWER
50 ?
SMA
CABLE
SUPPLY
HEWLETT PACKARD HP80000
PATTERN GENERATOR
SPECTRUM ANALYZER
FIGURE 2. INTERSIL HI5828 EVALUATION SYSTEM SETUP BLOCK DIAGRAM
3-3
相关PDF资料
HI5960SOICEVAL1 EVALUATION PLATFORM SOIC HI5960
HI7188EVAL EVALUATION PLATFORM HI7188
HI7190EVAL EVALUATION PLATFORM HI7190
HJ4-L-DC12V RELAY GEN PURPOSE 4PDT 5A 12V
HL2-HP-AC100V-F RELAY GEN PURPOSE DPDT 10A 100V
HLM01510Z16K50JJ RES 16.5K OHM 15W 5% WW
HMC1043-DEMO DEMONSTRATION BOARD FOR HMC1043
20021311-00034T1LF 集管和线壳 RCPT VT TH
相关代理商/技术参数
HI5828IN 功能描述:DAC DUAL 12BIT 130MHZ 48-LQFP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散(最大):- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率(每秒):*
HI5860 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:12-Bit, 125MSPS, CommLinkTM High Speed D/A Converter
HI5860 WAF 制造商:Intersil Corporation 功能描述:
HI5860_05 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:12-Bit, 130MSPS, High Speed D/A Converter
HI5860_08 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:12-Bit, 130MSPS, High Speed D/A Converter
HI5860IA 功能描述:CONV D/A 12BIT 130MSPS 28-TSSOP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散(最大):- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率(每秒):*
HI5860IA-T 功能描述:CONV D/A 12BIT 130MSPS 28-TSSOP RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散(最大):- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率(每秒):*
HI5860IB 功能描述:CONV D/A 12-BIT 130MSPS 28-SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散(最大):- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率(每秒):*